| 摘要 |
PURPOSE:To improve close contact of bonding pads of a semiconductor element to inner leads and Au wires by partly altering a temperature of a heater plate in a method for wire bonding to be conducted with heat and an ultrasonic wave. CONSTITUTION:A wire bonding is conducted by separating a heater plate for mounting a lead frame into an island heater plate 7 having a heater 12 and an inner lead heater plate 9 having a heater 11 through a heat insulator 8, and controlling temperatures of the plates 7 and 9 to differentiate the surface temperatures on a semiconductor element 1 and inner leads 4. |
