| 摘要 |
PURPOSE:To obtain a high-density and thin semiconductor device of high reliability by a method wherein a first semiconductor chip is mounted on one face of a lead frame and resin-sealed and, after that, a second semiconductor chip is mounted on the other face, bonded and resin-sealed. CONSTITUTION:A lead frame 1 provided with the following is formed: a semiconductor-chip mounting part; a plurality of inner leads; and a plurality of outer leads. Then, a first semiconductor chip 2a is mounted on the first face of the semiconductor-chip mounting part on the lead frame 1; the first semiconductor chip 2a is connected electrically to the inner leads; after that, only the side of the first face of the lead frame 1 is resin-sealed 4a in such a way that the first semiconductor chip 2a is covered. Then, a second semiconductor chip 2b is mounted on the second face of the semiconductor-chip mounting part on the lead frame 1; the semiconductor chip 2b is connected electrically to the inner leads; after that, the second face side of the lead frame 1 is resin-sealed 4b in such a way that the second semiconductor chip 2b is covered. |
