发明名称 Semiconductor device manufacturing method and semiconductor device manufactured thereby
摘要 A method for manufacturing a semiconductor device comprises the steps of forming a polysilicon spacer on an after-oxide film on a semiconductor substrate, doping the polysilicon spacer by ion-implanting an impurity such as phosphorus, thermally diffusing the impurity into the polysilicon spacer, and eliminating the polysilicon spacer in part by etching. A semiconductor device manufactured by this method is also disclosed.
申请公布号 US5212105(A) 申请公布日期 1993.05.18
申请号 US19910804506 申请日期 1991.12.10
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KIZU, TATSUKI;SHIMADA, SHINICHI;KOBAYASHI, KIYOSHI
分类号 H01L21/033;H01L21/336;H01L29/78 主分类号 H01L21/033
代理机构 代理人
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