METHOD OF SEALING SEMICONDUCTOR CHIP,申请号JP19910284525-传众专利搜索

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发明名称	METHOD OF SEALING SEMICONDUCTOR CHIP
摘要
申请公布号	JPH05121474(A)	申请公布日期	1993.05.18
申请号	JP19910284525	申请日期	1991.10.30
申请人	KAWASAKI STEEL CORP	发明人	YOSHIMOTO YUZO
分类号	H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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