发明名称 LEAD FRAME AND MANUFACTURE THEREOF
摘要 PURPOSE:To constitute thinner a part including each island than outer leads, nevertheless, to prevent the generation of strain due to die bonding. CONSTITUTION:Holes 100 are formed in a metallic plate 5 and after recessed parts 60 are formed by applying a pressure to an extent including each hole 100, islands 40 of a lead frame 10 are respectively formed in the recessed parts 60. By the formation of the recessed parts 60, the islands 40 and inner leads 20 become thinner than outer leads 30 and the lessened holes 100 for strain prevention use are respectively left in the islands 40.
申请公布号 JPH05121636(A) 申请公布日期 1993.05.18
申请号 JP19910311823 申请日期 1991.10.29
申请人 ROHM CO LTD 发明人 SHIBATA KAZUTAKA
分类号 H01L23/50;H01L21/48;H01L23/495 主分类号 H01L23/50
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