| 摘要 |
<p>PURPOSE:To reduce that a wafer is rubbed with a carrier and to reduce that a flaw and a crack are caused by executing the following simultaneously: an operation to re-erect wafers; and operation to make the direction of orientation flats uniform. CONSTITUTION:The title apparatus is provided with a pushing-out block 3 and a roller 2 which are installed on a carrier pedestal 6 and which are moved and turned by using a drive part 4. While wafers 1 in a carrier 5 mounted on the carrier pedestal 6 are being turned by using the pushing-out block 3 and the roller 2, the wafers 1 are moved toward a carrier 5a. While the direction of orientation flats of the wafers 1 is being made uniform, the wafers are reerected in the carrier 5a.</p> |
