| 摘要 |
<p>PURPOSE:To fix and ground a semiconductor chip without using a metal plate, by making a metal film on a grounded electrode provided on one end of the semiconductor chip and another metal film on a side wall extending to the grounded electrode. CONSTITUTION:Band-shaped wafers 12 are arranged on a holder 11 so that each wafer is located on one surface of the V-groove 11A of the holder. Band-shaped masks 13 of slightly smaller width than the wafers 12 are arranged on the wafers. Required elements are previously manufactured in the wafers 12. Source electrodes are also previously manufactured on the same ends of the surfaces of chips. Each wafer is shaped like a band by cutting-off in a direction along the source electrode. According to this arrangement, a portion of the source electrode of each wafer 12 is slightly exposed out of mask 13. A metal is coated by evaporation on the exposed portion so that metal films are made on at least part of the source electrode and a side wall extending to the part. After that, the wafer is divided into the chips. The chip is fixed on a grounded base by a brazing material. As a result, the source electrode is grounded and no metal plate is needed.</p> |
