发明名称 PLASMA PROCESSING SYSTEM
摘要 PURPOSE:To prevent dew condensation accompanying cooling and high frequency from leaking. CONSTITUTION:A cover 10, made of low thermal conductivity resin, such as vinyl chloride resin, is of cylindrical shape with a bottom. The cover 10 is provided so that it will cover the bottom side of a bottom electrode 3 and a refrigerant circulation pipe 8 with a gap between the cover and them. The cover 10 is fixed to a flange of the bottom part of a connecting material 5. In addition, the surface of the cover 10 has a conductor layer 10a formed by, for example, electroless nickel plating.
申请公布号 JPH05121333(A) 申请公布日期 1993.05.18
申请号 JP19910090401 申请日期 1991.04.22
申请人 TOKYO ELECTRON YAMANASHI KK 发明人 FUKAZAWA KAZUO;SUETSUGU MASACHIKA
分类号 H01L21/205;C23C14/56;C23C16/44;H01J37/32;H01L21/302;H01L21/3065;H01L21/31 主分类号 H01L21/205
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