| 摘要 |
<p>PURPOSE:To prevent a resin coat from becoming ununiform in thickness by a method wherein the transparent resin coat provided covering light emitting semiconductor chips and metal wires is formed of one-pack type thermosetting resin liquid set to 15-50cp in viscosity. CONSTITUTION:While an LED array print head A is transferred at a proper speed V along its lengthwise direction, resin liquid is sprayed from a first nozzle B on light emitting semiconductor chips 2 and metal wires 5 located between the chips 2 and drive ICs 3 and from a second nozzle C on metal wires 6 located between the drive ICs 3 and a wiring circuit pattern 4. One-pack type thermosetting resin liquid is used as the resin liquid concerned and set to 20cp in viscosity at a temperature of 25 deg.C. After resin liquid is applied, it is heated to a proper temperature to be set. As resin liquid is set low or to 15-50cp in viscosity, a resin coat over a light emitting element section 2a can be prevented from being thick, and the light emitting sections 2a can be limited to 5%, or below in brightness variation.</p> |
