| 摘要 |
PURPOSE:To locally improve wiring accommodation without increasing a conductor layer of a printed wiring board by wiring a lead wire with an insulating coat in an area whose wiring accommodation is insufficient by connecting electrodes at both ends of the lead wire with an insulating coat and a wiring pattern of a printed wiring substrate through a through-hole. CONSTITUTION:A resin sheet 3 is stretched over an upper side of a printed wiring substrate 2, heat is applied to make it semi-melted, a lead wire 6 with an insulating coat is buried and the sheet 3 is cured and solidified. Thereafter, an end point of the lead wire 6 with an insulating coat is bored and plated together with the printed wiring substrate 2 to form a through-hole 5; thereby, electrical connection is realized by the lead wire 6 with an insulating coat without using a wiring on the printed wiring board 2. Therefore, wiring accommodation can be locally improved on the printed wiring board 2 without increasing a conductor layer with an insulating coat in an area whose wiring accommodation is insufficient. |
