| 摘要 |
PURPOSE:To prevent the shortage of the bonding strength of a metal thin wire by a method wherein a bonding tool used to bond the side of a pad on a semiconductor element and a bonding tool used to bond the side of an internal terminal are formed respectively to be separately optimum shapes. CONSTITUTION:The title apparatus is provided with the following: a first bonding tool 1 which presses and bonds a metal thin wire in a bonding operation on the side of a bonding pad; and a second bonding tool 2 which presses and bonds the metal thin wire in a bonding operation of the internal terminal side. Each of the respective bonding tools has a double structure which can be actuated independently. |
