发明名称 CERAMIC CIRCUIT BOARD
摘要 <p>PURPOSE:To materialize the reduction of a wire for connection of circuits, the improvement of the current application efficiency, the exhibition of other additional functions, the compactification of the constitution, and others by improving the function, making effective use of the conductivity that the sub copper board has. CONSTITUTION:A copper circuit board 12 is joined to one side face of a ceramic board 11, and a sub copper board 15 to the other side face. A through hole 17 is bored in the ceramic board 12, and through the copper piece 18 filled up in this through hole 17, the copper circuit board 12 and the sub copper board 15 are joined with each other.</p>
申请公布号 JPH05121844(A) 申请公布日期 1993.05.18
申请号 JP19910283052 申请日期 1991.10.29
申请人 TOSHIBA CORP 发明人 KOMORIDA YUTAKA;MATSUMURA KAZUO;OISHI HIRONOBU
分类号 B32B15/04;H01L23/12;H05K1/02;H05K1/03;H05K1/11;H05K3/40 主分类号 B32B15/04
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