| 摘要 |
PURPOSE:To furnish a manufacturing method of a semiconductor element which makes it possible to discriminate a rejected product in a characteristic test and to maintain excellent visibility of a wafer number, without giving a mark of rejection to a marking part to which a wafer number such as a production number is marked. CONSTITUTION:On the occasion when an aluminum wiring process is executed in a manufacturing method of a semiconductor element wherein the semiconductor element is formed on a wafer 11 by a technique of photolithography, a marking part 12 of a wafer number such as a production number given on the wafer 11 is covered with a mask 16 so that the part covered with this mask 16 may not be exposed. |
