| 摘要 |
PURPOSE:To improve quality by actually transferring reticule patterns to a wafer and inspecting defects on the actual patterns. CONSTITUTION:The patterns are formed by using the reticule which has plural dies delivered from a mask stage to a photolithographic stage. The dies having these patterns and dies are compared and are automatically inspected. Namely, the isolated defect 1 constitutes a bridge 4 (b) and pattern chipping 2, 3 (a) constitute pattern chipping 5, 6 (b) when the patterns are actually transferred in such a case. Further, (c) is the same pattern as (b) and has no defects in the reticule. The bridge 4 and the pattern chipping 5, 6 are detected if the isolated defect 1 shown by (a), the pattern defects 2, 3 and the pattern defects 5, 6 shown by (b) are subjected to comparison and inspection by using an automatic inspecting device; for example, if the dies and the dies are compared and inspected with (b) and (c). |
