| 摘要 |
<p>PURPOSE:To improve the production efficiency of electrode substrates and to enable the easy formation and removal of auxiliary wirings also on various kinds of the electrode substrates varying in driving systems by removing the auxiliary wirings without cutting the substrates at the points where the auxiliary wirings are formed. CONSTITUTION:The auxiliary wirings 5 are removed without cutting the electrode substrate 1 at the point where the auxiliary wirings 5 are formed in the case the auxiliary wirings 5 commonly conducting to respective electrode wirings 3 are previously formed on the substrate 1, then the auxiliary wirings 5 unnecessary for driving of the electrode wirings 3 are removed to put the electrode wirings 3 into the non-conducting state to each other. The removal is executed by a photoetching means. For example, a positive resist is applied over the entire surface of the substrate 1. Only the resist of the parts to be removed is removed if the resist is exposed and developed after the parts exclusive of the parts to be removed are masked. The pars to be removed are thereafter simply required to be etched. As a result, the generation of waste in the substrate 1 is lessened and the plank layout efficiency is improved.</p> |
