发明名称 |
THERMAL TRANSFER TYPE CONDUCTIVE BODY FORMING MATERIAL AND METHOD FOR FORMING CONDUCTIVE BODY PATTERN |
摘要 |
PURPOSE:To obtain a thermal transfer-type conductive forming material which can be suitably used for forming a conductive body pattern such as an electrode with high accuracy by forming a heat-transferring conductive body layer prepd. by dispersing a specified ratio of an electrically conductive fine particle in a hot-melt binder contg. at least a wax on a supporting body. CONSTITUTION:A heat-transferring conductive body layer 5 prepd. by dispersing 83-97wt.% electrically conductive fine particle 4 (e.g. a copper fine particle), a hot-melt binder 3 (e.g. stearic acid) contg. at least a wax (e.g. carnauba wax) is formed on a supporting body 2 (e.g. a polyester film). A pattern is directly drawn on a base sheet by using the thus obtd. heat-sensitive transfer-type conductive forming material 1. As the result, it is possible to obtain a thermal transfer- type conductive forming material which can be used suitably for forming a conductive body pattern such as an electrode with high accuracy. |
申请公布号 |
JPH05116465(A) |
申请公布日期 |
1993.05.14 |
申请号 |
JP19920107495 |
申请日期 |
1992.04.27 |
申请人 |
TOSHIBA CORP |
发明人 |
OKUWADA HISAMI;YAMASHITA YOHACHI;FURUKAWA OSAMU;KANAI HIDEYUKI;OKUYAMA TETSUO |
分类号 |
B41F17/36;B41M5/30;B41M5/392 |
主分类号 |
B41F17/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|