发明名称 THERMAL TRANSFER TYPE CONDUCTIVE BODY FORMING MATERIAL AND METHOD FOR FORMING CONDUCTIVE BODY PATTERN
摘要 PURPOSE:To obtain a thermal transfer-type conductive forming material which can be suitably used for forming a conductive body pattern such as an electrode with high accuracy by forming a heat-transferring conductive body layer prepd. by dispersing a specified ratio of an electrically conductive fine particle in a hot-melt binder contg. at least a wax on a supporting body. CONSTITUTION:A heat-transferring conductive body layer 5 prepd. by dispersing 83-97wt.% electrically conductive fine particle 4 (e.g. a copper fine particle), a hot-melt binder 3 (e.g. stearic acid) contg. at least a wax (e.g. carnauba wax) is formed on a supporting body 2 (e.g. a polyester film). A pattern is directly drawn on a base sheet by using the thus obtd. heat-sensitive transfer-type conductive forming material 1. As the result, it is possible to obtain a thermal transfer- type conductive forming material which can be used suitably for forming a conductive body pattern such as an electrode with high accuracy.
申请公布号 JPH05116465(A) 申请公布日期 1993.05.14
申请号 JP19920107495 申请日期 1992.04.27
申请人 TOSHIBA CORP 发明人 OKUWADA HISAMI;YAMASHITA YOHACHI;FURUKAWA OSAMU;KANAI HIDEYUKI;OKUYAMA TETSUO
分类号 B41F17/36;B41M5/30;B41M5/392 主分类号 B41F17/36
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