发明名称 SURFACE TREATMENT AND COATING OF MOLDING OF POLYAMIDE RESIN COMPOSITION
摘要 PURPOSE:To provide the title process very excellent in coating efficiency, nonproblematic in environmental pollution, etc., mild to the earth, and appropriate for the new chemical era. CONSTITUTION:The title process for treating the surface of a molding of a polyamide resin composition comprises bringing the surface of a molding of a resin composition prepared by mixing 100 pts.wt. resin composition comprising 10-80wt.% polyamide resin and 20-90wt.% other thermoplastic resins with 0-20 pts.wt. at least one modifier selected from among a carboxylic acid containing at least two carboxyl groups in the molecule, its derivative, an amine containing at least two nitrogen atoms in the molecule, urea and its derivative and a low-molecular polyamide into contact with water; and the title process for coating the molding comprises bringing the surface of the molding into contact with water and coating the surface.
申请公布号 JPH05117424(A) 申请公布日期 1993.05.14
申请号 JP19910284652 申请日期 1991.10.30
申请人 SUMITOMO CHEM CO LTD 发明人 SHINONAGA HIDEO;MITSUI KIYOSHI;SUZUKI YASUAKI;SOGABE SATORU
分类号 C08J7/12;B05D3/10;C08G69/48;C08J7/00;C08K5/09;C08K5/16;C08K5/17;C08K5/21;C08L21/00;C08L23/00;C08L71/12;C08L77/00;C08L101/00 主分类号 C08J7/12
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