发明名称 A FILLING COMPOUND
摘要 2123200 9309208 PCTABS00022 The description relates to a filler for electrical and optical devices like cables, strips, plugs, etc., which is characterized by containing a material with a star-shaped molecular structure. Such includes especially an oligo-dec-1-en with a degree of oligomerisation of 3 and over. If to this is added finely divided silicic acid and a high-molecular polyolefine or a viscosity improver like hydrated polyisoprene, fillers are obtained having improved thermal properties like cone penetration at -50 ·C and leak resistance up to +80 ·C.
申请公布号 CA2123200(A1) 申请公布日期 1993.05.13
申请号 CA19922123200 申请日期 1992.10.29
申请人 HENKEL KGAA 发明人 HEUCHER REIMAR;WICHELHAUS JUERGEN;ANDRES JOHANNES
分类号 C08K3/00;C08K3/36;C08K5/01;C08K5/10;C08L23/00;C08L23/02;C08L53/02;C08L101/00;C09K3/10;C10M169/00;G02B6/44;H01B3/22;H01B7/28;H01B7/282;H01B7/285;H01B7/29;(IPC1-7):C10M169/00 主分类号 C08K3/00
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