| 摘要 |
POWER SEMICONDUCTOR PACKAGE A hermetically sealed power semiconductor package includes a body 11 and a thick metal back 24. The metal back serves as a mounting device as well as a thermal channel for the package eliminating the need for intermediate heatsinks. For example, fasteners 47 extending into the back 24 can be used to mount the package to a printed wiring board 38 and directly to a heatsink 44.
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