METALLIC MOLD FOR MOLDING

摘要

PURPOSE:To provide a metallic mold for molding having an excellent releasing property against a semiconductor device using a transparent molding resin for which no mold release agent can be used. CONSTITUTION:In this metallic mold 1 which is used for forming a semiconductor device by filling up a cavity formed by bringing a top part 11 and bottom part 12 into contact with each other and having a prescribed shape with a molding resin 4 and integrally sealing semiconductor elements arranged in the cavity with the resin, the lower surface 11a of the top part 11 and upper surface 12a of the bottom part 12 are plated 3 with nickel mixed with a fluorocarbon resin.