| 摘要 |
PURPOSE:To obtain a compsn. having excellent resolution, sensitivity and heat resistance and fit for a positive type resist for producing a high integrated circuit. CONSTITUTION:When a photosensitive resin compsn. contg. alkali-soluble novolak resin and a quinonediazido compd. is produced, the novolak resin is freed of a low mol.wt. component and a cyclic phenol compd. represented by the structural formula is further incorporated. A coating film of the resulting photosensitive resin compsn. is exposed and developed to produce a resist image. In the formula, R1 is H, alkyl or alkoxy, R2 is H, alkyl, alkoxy or phenyl, R1 and R2 may be the same and (n) is an integer of 4-8. |
