SEMICONDUCTOR DEVICE, ITS MANUFACTURE, AND LEAD FRAME USED THEREFOR

摘要

PURPOSE:To surely prevent the cracking of the resin-sealed package of a semiconductor device. CONSTITUTION:In the most area of a tub 20, slits 28 and 29 are formed so that an arbitrary straight and diagonal lines connecting facing sides of the tab 20 can be necessarily discontinued by either one of the slits 28 and 29. As a result, the occurrence of a thermal stress can be reduced and the cracking of a package can be prevented, because the tab 20 is discontinued by means of the slits 28 and 29 in an arbitrary direction.