| 摘要 |
PURPOSE:To provide an optical semiconductor device capable of dealing with a bidirectional optical transmisssion according to the use of the device. CONSTITUTION:A plated wiring is provided three-dimensionally on parts other than a light-emitting part in such a way that electrode terminals 3A and 3B are vertically placed or laterally placed on both sides of a recessed part 21 for LED chip mounting use from the recessed part 21 to a printed-wiring board and can be mounted. Thereby, top surface emission becomes possible by laterally placing the terminals 3A and 3B side surface emission becomes possible by vertically placing the terminals 3A and 3B. |
