发明名称 |
DEVICE FOR MEASURING CONTACT STATE OF GLAND PACKING |
摘要 |
PURPOSE:To enhance the reliability in the measurement of the contact stress of a gland packing by displaying a multiple reflected echo at the almost central part of the waveform display region of a display device. CONSTITUTION:A flaw detector part 1 transmits a pulse signal, to a probe 16 from a transmission terminal 11 and the echo receiving signal from the probe 16 is received by a receiving terminal 16 to be outputted to an A/D converter circuit 2. The circuit 2 successively transmits the echo receiving signal to the multiple reflected echo Bi from the contact surface 19 of a gland packing 17 and the inner peripheral surface of an object 18 to be inspected obtained from the flaw detector part 1 to a waveform data memory 3. The memory 3 issues a sampling completion signal to a microprocessor MPU 5 when the number of data sampled by the circuit 2 is stored up to a predetermined final address. The MPU 5 receives the completion signal from the memory 3 to stop the sampling processing of the circuit 2 and collects measured data from the memory 3 to form the display data of an A scope image and the A scope image is displayed on a CRT 8. |
申请公布号 |
JPH05113378(A) |
申请公布日期 |
1993.05.07 |
申请号 |
JP19910301091 |
申请日期 |
1991.10.21 |
申请人 |
KANSAI ELECTRIC POWER CO INC:THE;UTSUE VALVE KK;HITACHI CONSTR MACH CO LTD |
发明人 |
MURATA EIJI;HARA SHINICHI;YAMAMOTO ISAO;UEDA HIROHISA;MIYAGUCHI TAKUYA;MIYAJIMA TAKESHI;SHIBA YOSHIMI;TAKISHITA TOSHIO |
分类号 |
G01L5/00;G01D7/00;G01N29/00 |
主分类号 |
G01L5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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