发明名称 DEVICE FOR MEASURING CONTACT STATE OF GLAND PACKING
摘要 PURPOSE:To enhance the reliability in the measurement of the contact stress of a gland packing by displaying a multiple reflected echo at the almost central part of the waveform display region of a display device. CONSTITUTION:A flaw detector part 1 transmits a pulse signal, to a probe 16 from a transmission terminal 11 and the echo receiving signal from the probe 16 is received by a receiving terminal 16 to be outputted to an A/D converter circuit 2. The circuit 2 successively transmits the echo receiving signal to the multiple reflected echo Bi from the contact surface 19 of a gland packing 17 and the inner peripheral surface of an object 18 to be inspected obtained from the flaw detector part 1 to a waveform data memory 3. The memory 3 issues a sampling completion signal to a microprocessor MPU 5 when the number of data sampled by the circuit 2 is stored up to a predetermined final address. The MPU 5 receives the completion signal from the memory 3 to stop the sampling processing of the circuit 2 and collects measured data from the memory 3 to form the display data of an A scope image and the A scope image is displayed on a CRT 8.
申请公布号 JPH05113378(A) 申请公布日期 1993.05.07
申请号 JP19910301091 申请日期 1991.10.21
申请人 KANSAI ELECTRIC POWER CO INC:THE;UTSUE VALVE KK;HITACHI CONSTR MACH CO LTD 发明人 MURATA EIJI;HARA SHINICHI;YAMAMOTO ISAO;UEDA HIROHISA;MIYAGUCHI TAKUYA;MIYAJIMA TAKESHI;SHIBA YOSHIMI;TAKISHITA TOSHIO
分类号 G01L5/00;G01D7/00;G01N29/00 主分类号 G01L5/00
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