WIRING PATTERN CUTTING METHOD OF PRINTED WIRING BOARD

摘要

PURPOSE:To provide a method of cutting the wiring pattern of a printed wiring board where burrs induced by the variation of a laser output or the wiring pattern can be prevented from occurring. CONSTITUTION:A cutting method is carried out as follow: A laser be penetrating through a mask is concentrated through a lens and made irradiate the wiring pattern of a printed wiring board to cut it. The method concerned is composed of two steps, where a first step through which the lengthwise ends 18a and 18b of a wiring pattern 18 are irradiated with a laser beam to provide slits for them to cut them and a second step through which the central part 18c is irradiated with a laser beam to be cut are provided.