POLYAMIDE RESIN COMPOSITION, MOLDED OBJECT, AND HOUSING FOR ELECTRONIC DEVICE

摘要

PURPOSE:To provide a polyamide resin composition which is injection-moldable and suited for producing a thin-wall molding and has high strength, low moisture absorption, and good dimensional stability even after moisture absorption. CONSTITUTION:The title composition comprises 100 pts.wt. amorphous polyamide and 10-100 pts.wt. liquid-crystal polyester. It may further contain 3-40 pts.wt. reinforcing filler per 100 pts.wt. the sum of the two components. Moldings produced from this composition and each constituting the bottom of a housing for an electronic device are shown in Figs. (A) to (C), in which numeral 1 refers to a pin gate and numeral 2 to a weld.