| 摘要 |
PURPOSE:To enable alignment of a substrate without decreasing the throughput of the whole device, by controlling the movement position of a substrate to be treated, in accordance with the arrangement coordinates calculated on the basis of an arrangement model on the substrate to be treated. CONSTITUTION:From shot regions on a substrate W to be treated, at least three shot regions S1-S8 are selected, and positions of the respective marks MX, MY for position alignment are measured as the coordinate positions on a static coordinate system. On the basis of the previously given arrangement model of shot regions on a substrate W to be treated, predicted arrangement coordinates are calculated from set values of the arrangement coordinates. Parameters of a relation formula are so determined that the error between the coordinate positions of the measured marks MX, MY and the arrangement coordinates calculated from the relation formula become minimum. On the basis of the parameters and the predicted arrangement coordinates, actual arrangement coordinates of each shot region are calculated. By controlling the movement position of the substrate W to be treated in accordance with the actual arrangement coordinates, each shot region is position-aligned. |
