| 摘要 |
PURPOSE:To provide a mounting method through which an electronic device can be enhanced in manufacturing yield and reliability and electronic components can be substantially mounted in the recess of a mounting base in a self-aligned manner without making a clearance large between the electronic component and the recess of the mounting base. CONSTITUTION:When a semiconductor chip 13 processed into a rectangular shape is mounted in a rectangular recess 12 provided to a mounting base 11, the electronic component, 13 is fitted into the recess 12 first, and then fine vibrations induced by ultrasonic waves are applied to the mounting base 11 to surely set the electronic component 13 in the recess 12 at a predetermined position. |
