| 摘要 |
PURPOSE:To realize a thin DC brushless motor by mounting an IC chip below an armature and resin sealing the IC chip. CONSTITUTION:A recess 12 is made below an armature 9 in a metal substrate 7A covering the opening at the bottom of a frame 2. After mounting an IC chip 10A in the recess 12, the IC chip 10A is molded of thermosetting resin 13 thus eliminating restriction in the thicknesswise direction due to the thickness of a coil 8 applied onto the armature 9 and obtaining a thin DC brushless motor. |
