Accelerometer assembly with evaluation circuit.

摘要

A microaccelerometer package (10) is provided for use in on-board automotive safety control and navigational systems. The microaccelerometer package (10) is constructed so as to minimize the influence of extraneous mechanical stress and vibrational resonance on the micromachined accelerometer. The microaccelerometer package (10) includes a rigid housing (10) in which there is a cavity for receiving the micromachined accelerometer unit (16) and the signal-processing circuitry (24). The lower surface (46) of the cavity is interrupted by a recess (34) projecting below the plane of the lower surface (46). The micromachined accelerometer unit (16) is secured within the recess (34) so as to be below the plane of the lower surface (46). The signal-processing circuitry (24) is supported by a substrate (24) which is secured to the lower surface of the cavity. One edge of the substrate (24), on which are disposed a number of wire bond sites, partially projects over the accelerometer unit (16) within the recess (36), but no further than a corresponding number of wire bond sites (26) on the micromachined accelerometer unit (16). Electrically interconnecting the wire bond sites of the signal-processing circuitry and the micromachined accelerometer unit (16) are a corresponding number of electrical conductors (28,30). <IMAGE>