| 摘要 |
<p>This invention relates to a semiconductor laser module. The semiconductor laser module by silver soldering the holder part (8) of Kovar to the package (1) of Kovar, and then silver soldering the lens holder part (4) of pure iron or a stainless steel to the holder part (8). The lens holder part (4) has the convergent rod lens (2) fixedly soldered thereto by an Au/Sn solder of a high melting point of 280 DEG C. The semiconductor laser (6) is soldered fixedly onto the stem (7). The stem (7), the optical fiber (3) and the ferrule holder (10) are soldered fixedly at positions so that the light (L) emitted from the semiconductor laser (6) is converged by the convergent rod lens (2) at the light incidence end (3a) of the optical fiber (3) and the laser light is coupled to the optical fiber (3). By the above-mentioned arrangement, the convergent rod lens (2) can be fixed with high-melting-point joining means, and a semiconductor laser module for optical communications in which the deterioration of light connection repeatedly generated by heat stress is suppressed, can be obtained. <IMAGE></p> |
