发明名称 High capacitance structure in a semiconductor device
摘要 The present invention provides for a capacitor structure on a semiconductor substrate with an enhanced capacitance. The structure has a first layer of conducting strips parallel to each other on the substrate and a second layer of conducting strips which are parallel to each other. The second layer strips overlie and are substantially congruent to the first layer conducting strips in a top view of the semiconductor substrate. The first layer conducting strips are alternately connected to a first node and a second node, and the second layer conducting strips are alternately connected to the first node and the second node in such a manner that each first layer conducting strip and a second layer conducting strip overlying the first layer conducting strip are connected to different nodes. The first and second nodes form two opposing nodes of the capacitor structure.
申请公布号 US5208725(A) 申请公布日期 1993.05.04
申请号 US19920932425 申请日期 1992.08.19
申请人 AKCASU, OSMAN E. 发明人 AKCASU, OSMAN E.
分类号 H01L21/02;H01L23/522;H01L27/06;H01L29/92 主分类号 H01L21/02
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