发明名称 |
Wire bonding method and apparatus |
摘要 |
In a bonding method and apparatus, a vertical movement of a bonding arm holder that has a capillary at the tip end is detected by a linear sensor and data based upon such a detection is outputted by the sensor. The output date in a predetermined range is checked if it is within a permissible range. If the output data is within the permissible range, it is determined that the capillary has come into contact with a bonding surface, and such a determination can be made without being affected by noises that often occur in bonding apparatus caused by vibrations. |
申请公布号 |
US5207370(A) |
申请公布日期 |
1993.05.04 |
申请号 |
US19920890953 |
申请日期 |
1992.05.29 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
MOCHIDA, TOORU;TERAKADO, YOSHIMITSU;HIRAYANAGI, AKIHIRO |
分类号 |
H01L21/60;H01L21/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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