发明名称 Wire bonding method and apparatus
摘要 In a bonding method and apparatus, a vertical movement of a bonding arm holder that has a capillary at the tip end is detected by a linear sensor and data based upon such a detection is outputted by the sensor. The output date in a predetermined range is checked if it is within a permissible range. If the output data is within the permissible range, it is determined that the capillary has come into contact with a bonding surface, and such a determination can be made without being affected by noises that often occur in bonding apparatus caused by vibrations.
申请公布号 US5207370(A) 申请公布日期 1993.05.04
申请号 US19920890953 申请日期 1992.05.29
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 MOCHIDA, TOORU;TERAKADO, YOSHIMITSU;HIRAYANAGI, AKIHIRO
分类号 H01L21/60;H01L21/00 主分类号 H01L21/60
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