发明名称 |
IC card and a method for the manufacture of the same |
摘要 |
In an IC card of the invention, an IC module (3) is adhered to a first concave (9) of a card base (1) by means of an adhesive (7) and a gap (8) is formed between the outside surface of the IC module (3) and the inside surface of the first concave (9), the gap being wider in the inside upper part and narrower in the inside lower part of the first concave (9), so that the IC chip in the IC module (3) and the card base (1) can be protected from damages caused by bending of the the card base (1).
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申请公布号 |
US5208450(A) |
申请公布日期 |
1993.05.04 |
申请号 |
US19910777457 |
申请日期 |
1991.10.16 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
UENISHI, MITSUAKI;TAKASE, YOSHIHISA;FUJII, TAKASHI |
分类号 |
B42D15/10;G06K19/077 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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