发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To absorb a timing error due to a difference in a kind of a clamp, hold the drawing amount of a wire which is drawn from a capillary tip at a specific length, shorten a time interval from a connection of a second bonding point to a start of a next bonding point, and contrive a high speed. CONSTITUTION:A wire 9 is bond-connected to a first bonding point by a capillary 7 into which the wire 9 is inserted, the capillary 7 is moved to a second bonding point to be bond-connected, and after the wire 9 is drawn from a tip of the capillary 7 by a specific amount, the wire 9 is grasped by a clamp 8a to ascend the capillary 7 at a constant speed for a specific time interval or at a specific distance.
申请公布号 JPH05109804(A) 申请公布日期 1993.04.30
申请号 JP19910296634 申请日期 1991.10.17
申请人 KAIJO CORP 发明人 SUGITO TETSUO
分类号 H01L21/60 主分类号 H01L21/60
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