| 摘要 |
PURPOSE:To obtain a curved-surface multilayer wiring board having the high positional precision of lands and patterns on each curved surface of all layers and having not only a bend in one direction but also reduced curves such as a partial sphere, the paraboloid of revolution, etc. CONSTITUTION:A curved-surface laminated board as a base is manufactured by a heating press 6 in a base molding process 7a, curved-surface multilayers are formed by a stacking process 14a, in which a process, in which an internal layer pattern is shaped onto a curved surface by laser exposure (penta-axial NC) 9 and a single-sided copper-clad laminated board 13 is stacked by the heating press 6, is repeated at least once or more, an each-layer connection process 15, in which through-holes are formed, is conducted, and an external layer pattern is formed by laser exposure (penta-axial NC) 9. |
