| 摘要 |
<p>PURPOSE:To prevent the defectives such as melted hole, etc., by the increase in energy density that is caused by laser light converged at an end-face breakdown preventive layer and a sealing resin layer in the semiconductor laser device with low cost and formable mold type so as to obtain the semiconductor laser device with a long service life. CONSTITUTION:An end-face breakdown preventive layer 10 and sealing resin layer 9 that are formed on a forward emitting face 12 of laser diode element 1 is composed of the resin having smaller refractive index than that of an active layer 4. Therefore, the laser light is always expaNded in the respective layers 9 and 10, so that the increase in energy density can be prevented.</p> |
