| 摘要 |
PURPOSE:To realize a cooling structure having high cooling efficiency, to improve cooling efficiency since thickness of a cooler can be relatively thick and to provide high resistance against corrosion by liquid coolant. CONSTITUTION:A cooling structure for an integrated circuit package comprises a plurality of integrated circuits 2 mounted in a matrix array on a wiring board 1, a cooler 3 mounted on each integrated circuit using a collision jet of liquid coolant, a holding plate 10 fixed to a frame 8 attached to the wiring board 1 for positioning and holding each cooler 3 with respect to each integrated circuit 2 and a coil spring 11 for pushing each cooler 3 to each integrated circuit 2, so that the integrated circuit is cooled by the cooler using the collision jet of the liquid coolant as well as the cooler is pushed against the integrated circuit by the coil spring. |
