| 摘要 |
PURPOSE:To remove the generation of an overflowing resin from a blind through-hole and removal operation thereof in the manufacture of a multilayer printed wiring board. CONSTITUTION:In a method, in which a plurality of boards 91, 92, to which internal layer circuits 99 and blind through-holes 3 are formed, are laminated through prepregs 5 and these boards, circuits 99, through-holes 3 and prepregs 5 are heated and contact-bonded and a multilayer printed wiring board is manufactured, the insides of the blind through-holes 3 are filled with a resin 1 for filling from the sides of the internal layer circuits 99 in the boards 91, 92 before the boards 91, 92 and the prepregs 5 are laminated. It is favorable that the whole surfaces of the internal layer circuits 99 of the boards are also coated with the resin 1 for filling. Double printing by screen printing is used as the filling method. |
