发明名称 MANUFACTURE OF MULTILAYER WIRING BOARD
摘要 PURPOSE:To position a laminated board constituting a multilayer wiring board accurately, and to facilitate easy mounting and fixing. CONSTITUTION:A positioning projecting section 8 composed of a truncated-cone- shaped thermoplastic resin is formed onto release paper 7, positioning ports are formed previously to copper-clad laminated boards 1, 3, 5 and prepregs 2, 14 laminated onto the release paper 7, and the laminated boards are positioned by the positioning projecting section 8 when the laminated boards are laminated. Each laminated board is unified under a positioned state by the thermoplastic resin by heating and pressing the laminated boards under a laminated state. Accordingly, a multilayer wiring board positioned accurately can be manufactured easily.
申请公布号 JPH05110253(A) 申请公布日期 1993.04.30
申请号 JP19910264585 申请日期 1991.10.14
申请人 SONY CORP 发明人 OKAJI AKIMASA
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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