发明名称 CERAMIC PACKAGE
摘要 PURPOSE:To prevent creeping up of a brazing material of a stud which is brazed for fixing a radiation fin. CONSTITUTION:A chip 5 is mounted on a cavity 1a, heat generated from a lead base 1 consisting of a ceramic material and the chip 5 is diffused, a radiation fin 2 consisting of a metallic material of good heat conduction and a lower edge face abut to a wall side of the lead base 1 with its back toward the chip 5 and brazed, and an upper part is engaged with an attaching hole 2a shaped in the radiation film 2 and fixes the radiation fin 2. The device is also constituted of a stud 3 which consists of a columnar heat resistant metallic material whereto a plating layer 4 is applied to be wet with a brazing material 6. The stud 3 is constituted to be exposed in its upper part not in its lower part near an edge face.
申请公布号 JPH05109948(A) 申请公布日期 1993.04.30
申请号 JP19910268078 申请日期 1991.10.17
申请人 FUJITSU LTD;FUJITSU TOHOKU ELECTRON:KK 发明人 MANABE HIDEAKI
分类号 H01L23/40;H01L23/34 主分类号 H01L23/40
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