发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To lower the wiring impedance of a power circuit, and to eliminate a bypass capacitor. CONSTITUTION:An electrical part, etc., are mounted on the surface of a first conductive layer 1, and a signal circuit is printed-wired to the first conductive layer, a power circuit to a second conductive layer 3 while holding an insulating layer 2, a ground to a third conductive layer while holding a dielectric layer 4 and a signal circuit to a fourth conductive layer while holding an insulating layer 6 respectively. A dielectric material having high insulating properties and a large dielectric constant is used as the dielectric material of the dielectric layer 4.
申请公布号 JPH05110265(A) 申请公布日期 1993.04.30
申请号 JP19910264395 申请日期 1991.10.14
申请人 NEC CORP;NEC MIYAGI LTD 发明人 HAYASHI OSAMU;SATO YASUYUKI
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址