| 摘要 |
PURPOSE: To electrically connect a substrate and a tape automatic bonding frame by utilizing shear stress. CONSTITUTION: Conductive traces 12, 14, and 16 of a tape automatic bonding frame and pipelines 26, 28, 30, and 32 of a substrate 34 are electrically connected by pressing ribs 44 and 46 from an area above the frame and deforming the frame. The conductive trace has inner lead edges and external lead edges 18, 20, 22, and 24, and an outer lead edge is arranged so that it is adapted to the pipeline. Therefore, when the frame is pressed to a substrate side by a load plate and is deformed, the outer lead edge of the frame is brought into contact with the projection connection region of the substrate, thus achieving an electrical connection. |
