| 摘要 |
PURPOSE:To obtain sufficient bonding strength at a low temperature without making enlarging the tip of a capillary by a method wherein a wire is fed out while being pressed against a member to be bonded through the capillary. CONSTITUTION:A wire 3 is inserted into a hole of a capillary 4 fitted into a bonding arm 13, and also a light source 16 for irradiating a heating light L to a bonding part is fitted into a holding arm 17. The wire 3 is pressed against a lead part 5 and ultrasonic energy is applied while an XY stage 11 is operated, whereby the capillary 4 is driven in the direction of an arrow A along the lead part 5 to feed out the wire 3. The wire 3 and the lead part 5 are melted by heat energy obtained from a heater and the light source 16 as well as the ultrasonic energy from the capillary 4 and bonded. A connecting area can be enlarged without enlarging the tip of the capillary, whereby sufficient bonding strength can be obtained in low temperature bonding. |
