| 摘要 |
<p>PURPOSE:To maintain strength and prevent deformation in the multiplication of leads with a smaller pitch by integrally bonding outer leads to connecting pads with their connections supported by an outer lead support of an insulating support film. CONSTITUTION:A heat-proof film 2 is superposed on a thermoplastic film 3 and bonded thereto to form an insulating support film 1. A conductor layer is laminated on the thermoplastic film 3 and leads 5 are formed. Outer leads 51 are connected to connecting pads 7 on the circuit board 6. In that time all outer leads 51 in an array are integrally bonded with their connections supported by an outer lead support 11 of the insulating support film 1 Compared with one lead 5, consequently, the strength is multiplied by a number of integrated leads. Even after cut off, a resultant TAB type IC 9 has sufficient strength respectively. This prevents a lead 5 from bending or breaking. In addition shortness of its projections virtually eliminates the deformation of outer leads 51 when handled.</p> |
