| 摘要 |
<p>PURPOSE:To obtain a resistor which has an excellent moisture resistant performance and, what is more, enhances its temperature cycle performance by increasing a linear expansion coefficient of casing resin from the surface of a sintered material to the outer surface. CONSTITUTION:Ag paste is printed and baked on both main sides of a sintered material 1, thereby forming an Ag electrode 2. Then, a lead wire 4 is brazed on the electrode 2 with solder 3. An outer easing is further formed on the outside. At that time, a first epoxy layer 5, a second epoxy layer 6 and a third epoxy layer 7 are laminated from the surface of the sintered material in the lower order of their linear expansion coefficients and cured. Their respective linear coefficients can be controlled by changing the weight ratio between epoxy group organic resin and oxide silicon powder. It is, therefore possible to maintain the heat resistant performance and reduce varistor voltage changes in the temperature cycle.</p> |
