| 摘要 |
PURPOSE:To prevent generation of crack and void in sealing resin and a solder resist layer even if a heating treatment such as a reflow treatment of cream solder is performed after a resin sealed semiconductor is stored in the air for a long period. CONSTITUTION:A solder resist layer 4 is provided to enclose a sealing area 1A of a semiconductor 2 on a substrate 1, the semiconductor 2 is mounted inside the sealing area 1A, and a semiconductor is sealed by supplying and curing uncured sealing resin 8 to the sealing area 1A. In such a sealing method of a semiconductor, a boundary and a peripheral part thereof between the sealing resin 8 and the solder resist layer 4 are covered with resin having a thermal expansion coefficient which is intermediate between those of the sealing resin 8 and the solder resist layer 4 and having water resistance which is higher than that of the both. |
