发明名称 LEAD FRAME
摘要 PURPOSE:To provide a lead frame excellent in anti-corrosion property which comprises iron or a material mainly containing iron with thin noble metal plated over an entire surface. CONSTITUTION:A lead frame comprising a surface of a material made of iron or metal mainly containing iron with a noble metal plated layer 1mum or less thick formed on an entire surface is characterized by a process wherein a first plate layer 12 made of a copper or copper alloy plated layer is formed on the material 10, a second plated layer 14 made of nickel, cobalt or a nickel- cobalt layer is formed on the first plated layer 12, and a noble metal plated layer 16 is formed on the second plated layer 14.
申请公布号 JPH05109958(A) 申请公布日期 1993.04.30
申请号 JP19910298219 申请日期 1991.10.17
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MURATA AKIHIKO;WAKABAYASHI NORIO
分类号 H01L23/48;H01L23/495;H01L23/50 主分类号 H01L23/48
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