发明名称 DIE BONDING DEVICE
摘要 PURPOSE:To obtain a device which is capable of confirming efficiently a collet contact without manpower and protecting the collet from damage by detecting changes in an output signal of an approach sensor, grasping a contact state between a support member and a block member and controlling the drive of a transfer means based on their contacted state. CONSTITUTION:A carrier means which carries a lead frame 3 to a bonding position of a chip 5 intermittently, a collect 4 which holds the chip 5, a support member 10 which supports the collect 4 and a block member 12 which has a site in contact with the support member 10 are provided. Transfer means 25, 26 and 29 which transfer the block member 12 to the lead frame side 12, a pressing means 16 which presses the support member 10 to the contact side of the block member 12 and a proximity sensor 18 mounted to the support member 10 or the block member 12 are provided, also a control means 20 which detects changes in an output signal of the proximity sensor 18, grasps a contact state between the support member 10 and the block member 12 and controls the drive of the transfer means 25, 26 and 29 are provided.
申请公布号 JPH05109787(A) 申请公布日期 1993.04.30
申请号 JP19910272531 申请日期 1991.10.21
申请人 MATSUSHITA ELECTRON CORP 发明人 TAKAOKA KIYOSHI;NISHINO NORIO
分类号 H01L21/52 主分类号 H01L21/52
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