发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PURPOSE:To prevent that, when a semiconductor device is operated at a high frequency, a current flowing through wiring concentrates in the vicinity of a substrate surface on account of the skin effect, apparent wiring resistance increases, and operation speed is decreased. CONSTITUTION:A wiring system is provided, which contains wiring constituted by completely surrounding the periphery of an insulating film 3b by metal conductor as the main wiring material. A contact aperture part 2 and a through hole aperture part T are filled with the main wiring material. As a result, the surface of the conductor constituting the wiring exists on the interface with the insulating film 3b buried in the inside as well as on the outside. Thereby the current density in the conductor can be kept uniform, and apparent increase of wiring resistance is restrained. Further contact resistance and through hole resistance are decreased, and high speed operation can be ensured.
申请公布号 JPH05109708(A) 申请公布日期 1993.04.30
申请号 JP19910269810 申请日期 1991.10.18
申请人 NEC CORP 发明人 ODA NORIAKI
分类号 H01L21/3205;H01L23/485;H01L23/52;H01L23/528;H01L23/532 主分类号 H01L21/3205
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